BibTeX record conf/3dic/VianneBFPCGFCEHT13

• > Home > conf/3dic/VianneBFPCGFCEHT13

@inproceedings{DBLP:conf/3dic/VianneBFPCGFCEHT13,
  author       = {Benjamin Vianne and
                  Pierre Bar and
                  Vincent Fiori and
                  Sebastien Petitdidier and
                  Norbert Chevrier and
                  S{\'{e}}bastien Gallois{-}Garreignot and
                  Alexis Farcy and
                  Pascal Chausse and
                  Stephanie Escoubas and
                  Nicolas Hotellier and
                  Olivier Thomas},
  title        = {Thermo-mechanical study of a 2.5D passive silicon interposer technology:
                  Experimental, numerical and In-Situ stress sensors developments},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702332},
  doi          = {10.1109/3DIC.2013.6702332},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/VianneBFPCGFCEHT13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}