BibTeX record conf/3dic/TehCQAOGMSMCWMGD09

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@inproceedings{DBLP:conf/3dic/TehCQAOGMSMCWMGD09,
  author    = {Weng Hong Teh and
               Raymond Caramto and
               Jamal Qureshi and
               Sitaram Arkalgud and
               M. O'Brien and
               T. Gilday and
               Kou Maekawa and
               T. Saito and
               Kouichi Maruyama and
               Thenappan Chidambaram and
               Wei Wang and
               David Marx and
               David Grant and
               Russ Dudley},
  title     = {A route towards production-worthy 5 {\(\mathrm{\mu}\)}m {\texttimes}
               25 {\(\mathrm{\mu}\)}m and 1 {\(\mathrm{\mu}\)}m {\texttimes} 20 {\(\mathrm{\mu}\)}m
               non-Bosch through-silicon-via {(TSV)} etch, {TSV} metrology, and {TSV}
               integration},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--5},
  publisher = {{IEEE}},
  year      = {2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306562},
  doi       = {10.1109/3DIC.2009.5306562},
  timestamp = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl    = {https://dblp.org/rec/conf/3dic/TehCQAOGMSMCWMGD09.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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