BibTeX record conf/3dic/SinghT09

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@inproceedings{DBLP:conf/3dic/SinghT09,
  author       = {Shiv Govind Singh and
                  Chuan Seng Tan},
  title        = {Impact of thermal through silicon via {(TTSV)} on the temperature
                  profile of multi-layer 3-D device stack},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306527},
  doi          = {10.1109/3DIC.2009.5306527},
  timestamp    = {Thu, 14 Oct 2021 09:53:39 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/SinghT09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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