BibTeX record conf/3dic/SantosSCCCVBRJF14

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@inproceedings{DBLP:conf/3dic/SantosSCCCVBRJF14,
  author       = {Cristiano Santos and
                  Papa Momar Souare and
                  Fran{\c{c}}ois de Crecy and
                  Perceval Coudrain and
                  Jean{-}Philippe Colonna and
                  Pascal Vivet and
                  Andras Borbely and
                  Ricardo Reis and
                  M. Haykel Ben Jamaa and
                  Vincent Fiori and
                  Alexis Farcy},
  title        = {Using TSVs for thermal mitigation in 3D circuits: Wish and truth},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152167},
  doi          = {10.1109/3DIC.2014.7152167},
  timestamp    = {Thu, 21 Jan 2021 17:36:37 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/SantosSCCCVBRJF14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}