BibTeX record conf/3dic/OharaNSLMBYFTK09

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@inproceedings{DBLP:conf/3dic/OharaNSLMBYFTK09,
  author    = {Yuki Ohara and
               Akihiro Noriki and
               Katsuyuki Sakuma and
               Kang Wook Lee and
               Mariappan Murugesan and
               Jichoel Bea and
               Fumiaki Yamada and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {10 {\(\mathrm{\mu}\)}m fine pitch Cu/Sn micro-bumps for 3-D super-chip
               stack},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--6},
  year      = {2009},
  crossref  = {DBLP:conf/3dic/2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306532},
  doi       = {10.1109/3DIC.2009.5306532},
  timestamp = {Sun, 21 May 2017 00:18:56 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/OharaNSLMBYFTK09},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2009,
  title     = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  publisher = {{IEEE}},
  year      = {2009},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=5290624},
  isbn      = {978-1-4244-4511-0},
  timestamp = {Wed, 25 Nov 2015 15:22:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2009},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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