BibTeX record conf/3dic/NishizawaASSI13

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@inproceedings{DBLP:conf/3dic/NishizawaASSI13,
  author       = {S. Nishizawa and
                  Ryohei Arima and
                  Tomohiro Shimizu and
                  Shoso Shingubara and
                  Fumihiro Inoue},
  title        = {Highly conformal and adhesive electroless barrier and Cu seed formation
                  using nanoparticle catalyst for realizing a high aspect ratio cu-filled
                  {TSV}},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702392},
  doi          = {10.1109/3DIC.2013.6702392},
  timestamp    = {Sun, 25 Oct 2020 22:39:59 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/NishizawaASSI13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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