BibTeX record conf/3dic/MurugesanOBLFTK10

download as .bib file

@inproceedings{DBLP:conf/3dic/MurugesanOBLFTK10,
  author    = {Mariappan Murugesan and
               Yuki Ohara and
               Jichoel Bea and
               Kang Wook Lee and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Impact of microbump induced stress in thinned 3D-LSIs after wafer
               bonding},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
               Munich, Germany, 16-18 November 2010},
  pages     = {1--5},
  year      = {2010},
  crossref  = {DBLP:conf/3dic/2010},
  url       = {https://doi.org/10.1109/3DIC.2010.5751432},
  doi       = {10.1109/3DIC.2010.5751432},
  timestamp = {Sun, 21 May 2017 00:18:57 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanOBLFTK10},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2010,
  title     = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
               Munich, Germany, 16-18 November 2010},
  publisher = {{IEEE}},
  year      = {2010},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=5742028},
  isbn      = {978-1-4577-0526-7},
  timestamp = {Wed, 25 Nov 2015 15:22:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2010},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
maintained by Schloss Dagstuhl LZI, founded at University of Trier