BibTeX record conf/3dic/MurugesanHKFTK11

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@inproceedings{DBLP:conf/3dic/MurugesanHKFTK11,
  author       = {Mariappan Murugesan and
                  Hideto Hashiguchi and
                  Harufumi Kobayashi and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262970},
  doi          = {10.1109/3DIC.2012.6262970},
  timestamp    = {Fri, 27 Dec 2019 21:20:47 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/MurugesanHKFTK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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