BibTeX record conf/3dic/MurugesanBHLKFT15

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@inproceedings{DBLP:conf/3dic/MurugesanBHLKFT15,
  author    = {Mariappan Murugesan and
               Jichoel Bea and
               H. Hashimoto and
               K. W. Lee and
               Mitsu Koyanagi and
               Takafumi Fukushima and
               Tetsu Tanaka},
  title     = {Mitigating thermo mechanical stress in high-density 3D-LSI through
               dielectric liners in Cu- through silicon Via {\_} {\(\mathrm{\mu}\)}-RS
               and {\(\mathrm{\mu}\)}-XRD study},
  booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  pages     = {TS8.10.1--TS8.10.5},
  year      = {2015},
  crossref  = {DBLP:conf/3dic/2015},
  url       = {https://doi.org/10.1109/3DIC.2015.7334579},
  doi       = {10.1109/3DIC.2015.7334579},
  timestamp = {Sun, 21 May 2017 00:18:56 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanBHLKFT15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2015,
  title     = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7328029},
  isbn      = {978-1-4673-9385-0},
  timestamp = {Thu, 26 Nov 2015 10:04:17 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2015},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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