BibTeX record conf/3dic/MurugesanBFMTK16

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@inproceedings{DBLP:conf/3dic/MurugesanBFMTK16,
  author    = {Mariappan Murugesan and
               Jichel Bea and
               Takafumi Fukushima and
               Makoto Motoyoshi and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed
               TiSix for via-last {TSV} technology},
  booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
               2016, San Francisco, CA, USA, November 8-11, 2016},
  pages     = {1--4},
  year      = {2016},
  crossref  = {DBLP:conf/3dic/2016},
  url       = {https://doi.org/10.1109/3DIC.2016.7970017},
  doi       = {10.1109/3DIC.2016.7970017},
  timestamp = {Thu, 13 Jul 2017 17:54:21 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanBFMTK16},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2016,
  title     = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
               2016, San Francisco, CA, USA, November 8-11, 2016},
  publisher = {{IEEE}},
  year      = {2016},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7959775},
  isbn      = {978-1-5090-1399-9},
  timestamp = {Thu, 13 Jul 2017 17:13:18 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2016},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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