BibTeX record conf/3dic/McDonaldEJBGZCKCDLK09

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@inproceedings{DBLP:conf/3dic/McDonaldEJBGZCKCDLK09,
  author       = {John F. McDonald and
                  Okan Erdogan and
                  Philip Jacob and
                  Paul M. Belemjian and
                  Alexey Gutin and
                  Aamir Zia and
                  Michael Chu and
                  Jin Woo Kim and
                  Ryan Clarke and
                  Nate DeSimone and
                  Sherry Liu and
                  Russell P. Kraft},
  title        = {Thermal analysis for a SiGe {HBT} 40 watt 32 GHz clock 3D memory processor
                  chip stack using diamond heat spreader layers},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306570},
  doi          = {10.1109/3DIC.2009.5306570},
  timestamp    = {Thu, 29 Feb 2024 13:56:08 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/McDonaldEJBGZCKCDLK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}