BibTeX record conf/3dic/LiuSM15

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@inproceedings{DBLP:conf/3dic/LiuSM15,
  author       = {Jiatong Liu and
                  Ken Suzuki and
                  Hideo Miura},
  title        = {Variation of thermal stress in {TSV} structures caused by crystallinity
                  of electroplated copper interconnections},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.5.1--TS8.5.5},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334610},
  doi          = {10.1109/3DIC.2015.7334610},
  timestamp    = {Sat, 30 Sep 2023 09:32:44 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LiuSM15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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