BibTeX record conf/3dic/LeeNNBMFTK14

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@inproceedings{DBLP:conf/3dic/LeeNNBMFTK14,
  author    = {K. W. Lee and
               Chisato Nagai and
               Ai Nakamura and
               Ji Chel Bea and
               Mariappan Murugesan and
               Takafumi Fukushima and
               Tanaka Tanaka and
               Mitsumasa Koyanagi},
  title     = {Effects of electro-less Ni layer as barrier/seed layers for high reliable
               and low cost Cu {TSV}},
  booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
               Ireland, December 1-3, 2014},
  pages     = {1--4},
  year      = {2014},
  crossref  = {DBLP:conf/3dic/2014},
  url       = {https://doi.org/10.1109/3DIC.2014.7152153},
  doi       = {10.1109/3DIC.2014.7152153},
  timestamp = {Thu, 13 Jul 2017 17:45:52 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeNNBMFTK14},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2014,
  title     = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
               Ireland, December 1-3, 2014},
  publisher = {{IEEE}},
  year      = {2014},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7147632},
  isbn      = {978-1-4799-8472-5},
  timestamp = {Wed, 15 Jul 2015 09:40:08 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2014},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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