BibTeX record conf/3dic/LeeNNBMFTK14

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@inproceedings{DBLP:conf/3dic/LeeNNBMFTK14,
  author       = {K. W. Lee and
                  Chisato Nagai and
                  Ai Nakamura and
                  Ji Chel Bea and
                  Mariappan Murugesan and
                  Takafumi Fukushima and
                  Tanaka Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Effects of electro-less Ni layer as barrier/seed layers for high reliable
                  and low cost Cu {TSV}},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152153},
  doi          = {10.1109/3DIC.2014.7152153},
  timestamp    = {Fri, 27 Dec 2019 21:20:47 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/LeeNNBMFTK14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}