BibTeX record conf/3dic/LeeNNABKHFT15

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@inproceedings{DBLP:conf/3dic/LeeNNABKHFT15,
  author    = {K. W. Lee and
               Chisato Nagai and
               Ai Nakamura and
               H. Aizawa and
               Ji Chel Bea and
               Mitsumasa Koyanagi and
               Hideto Hashiguchi and
               Takafumi Fukushima and
               Tanaka Tanaka},
  title     = {Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology
               for ultra-high density 3D integration using recessed oxide, thin glue
               adhesive, and thin metal capping layers},
  booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  pages     = {TS1.2.1--TS1.2.4},
  year      = {2015},
  crossref  = {DBLP:conf/3dic/2015},
  url       = {https://doi.org/10.1109/3DIC.2015.7334471},
  doi       = {10.1109/3DIC.2015.7334471},
  timestamp = {Thu, 13 Jul 2017 17:45:41 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeNNABKHFT15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2015,
  title     = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7328029},
  isbn      = {978-1-4673-9385-0},
  timestamp = {Thu, 26 Nov 2015 10:04:17 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2015},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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