BibTeX record conf/3dic/LeeBFOTK11

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@inproceedings{DBLP:conf/3dic/LeeBFOTK11,
  author    = {Kang Wook Lee and
               Jichoel Bea and
               Takafumi Fukushima and
               Yuki Ohara and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {High reliable and fine size of 5-{\(\mu\)}m diameter backside Cu through-silicon
               Via(TSV) for high reliability and high-end 3-D LSIs},
  booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
               Osaka, Japan, January 31 - February 2, 2012},
  pages     = {1--4},
  year      = {2011},
  crossref  = {DBLP:conf/3dic/2011},
  url       = {https://doi.org/10.1109/3DIC.2012.6262975},
  doi       = {10.1109/3DIC.2012.6262975},
  timestamp = {Sun, 21 May 2017 00:18:56 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeBFOTK11},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2011,
  editor    = {Mitsumasa Koyanagi and
               Morihiro Kada},
  title     = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
               Osaka, Japan, January 31 - February 2, 2012},
  publisher = {{IEEE}},
  year      = {2012},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6253019},
  isbn      = {978-1-4673-2189-1},
  timestamp = {Wed, 05 Sep 2012 18:40:30 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2011},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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