BibTeX record conf/3dic/LeeBFOTK11

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@inproceedings{DBLP:conf/3dic/LeeBFOTK11,
  author       = {Kang Wook Lee and
                  Jichoel Bea and
                  Takafumi Fukushima and
                  Yuki Ohara and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {High reliable and fine size of 5-{\(\mu\)}m diameter backside Cu through-silicon
                  Via(TSV) for high reliability and high-end 3-D LSIs},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262975},
  doi          = {10.1109/3DIC.2012.6262975},
  timestamp    = {Tue, 16 Feb 2021 15:53:52 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/LeeBFOTK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}