BibTeX record conf/3dic/KoharaHSMYOSKK11

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@inproceedings{DBLP:conf/3dic/KoharaHSMYOSKK11,
  author       = {Sayuri Kohara and
                  Akihiro Horibe and
                  Kuniaki Sueoka and
                  Keiji Matsumoto and
                  Fumiaki Yamada and
                  Yasumitsu Orii and
                  Katsuyuki Sakuma and
                  Takahiro Kinoshita and
                  Takashi Kawakami},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Thermal stress analysis of die stacks with fine-pitch {IMC} interconnections
                  for 3D integration},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6263002},
  doi          = {10.1109/3DIC.2012.6263002},
  timestamp    = {Sat, 19 Oct 2019 20:03:18 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KoharaHSMYOSKK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}