BibTeX record conf/3dic/KitadaTMIDTNS16

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@inproceedings{DBLP:conf/3dic/KitadaTMIDTNS16,
  author       = {Hideki Kitada and
                  Hiroko Tashiro and
                  Shoichi Miyahara and
                  Takeshi Ishitsuka and
                  Aki Dote and
                  Shinji Tadaki and
                  Tatsumi Nakada and
                  Seiki Sakuyama},
  title        = {Study of {MOSFET} thermal stability with {TSV} in operation temperature
                  using novel 3D-LSI stress analysis},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7969997},
  doi          = {10.1109/3DIC.2016.7969997},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KitadaTMIDTNS16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}