BibTeX record conf/3dic/KinoHTSIFKT15

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@inproceedings{DBLP:conf/3dic/KinoHTSIFKT15,
  author       = {Hisashi Kino and
                  Hideto Hashiguchi and
                  Seiya Tanikawa and
                  Yohei Sugawara and
                  Shunsuke Ikegaya and
                  Takafumi Fukushima and
                  Mitsumasa Koyanagi and
                  Tetsu Tanaka},
  title        = {Consideration of microbump layout for reduction of local bending stress
                  due to {CTE} Mismatch in 3D {IC}},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.26.1--TS8.26.4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334596},
  doi          = {10.1109/3DIC.2015.7334596},
  timestamp    = {Thu, 14 Oct 2021 09:53:39 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KinoHTSIFKT15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}