BibTeX record conf/3dic/JungKKKKBC15

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@inproceedings{DBLP:conf/3dic/JungKKKKBC15,
  author       = {Daniel H. Jung and
                  Heegon Kim and
                  Jonghoon J. Kim and
                  Sukjin Kim and
                  Joungho Kim and
                  Hyun{-}Cheol Bae and
                  Kwang{-}Seong Choi},
  title        = {Modeling and analysis of defects in through silicon via channel for
                  non-invasive fault isolation},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.29.1--TS8.29.4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334599},
  doi          = {10.1109/3DIC.2015.7334599},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/JungKKKKBC15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}