BibTeX record conf/3dic/JourdainVIRMBBW16

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@inproceedings{DBLP:conf/3dic/JourdainVIRMBBW16,
  author       = {Anne Jourdain and
                  Joeri De Vos and
                  Fumihiro Inoue and
                  Kenneth J. Rebibis and
                  Andy Miller and
                  Gerald Beyer and
                  Eric Beyne and
                  Edward Walsby and
                  Jash Patel and
                  Oliver Ansell and
                  Janet Hopkins and
                  Huma Ashraf and
                  Dave Thomas},
  title        = {Extreme wafer thinning optimization for via-last applications},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970028},
  doi          = {10.1109/3DIC.2016.7970028},
  timestamp    = {Thu, 14 Oct 2021 09:53:38 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/JourdainVIRMBBW16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}