BibTeX record conf/3dic/GopeCACPC13

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@inproceedings{DBLP:conf/3dic/GopeCACPC13,
  author       = {Dipanjan Gope and
                  S. Chatterjee and
                  D. de Araujo and
                  Swagato Chakraborty and
                  James Pingenot and
                  Raul Camposano},
  title        = {Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias
                  in system modeling},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702340},
  doi          = {10.1109/3DIC.2013.6702340},
  timestamp    = {Tue, 13 Jun 2023 15:10:51 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/GopeCACPC13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}