BibTeX record conf/3dic/FukushimaSHNBHM15

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@inproceedings{DBLP:conf/3dic/FukushimaSHNBHM15,
  author    = {Takafumi Fukushima and
               Taku Suzuki and
               Hideto Hashiguchi and
               Chisato Nagai and
               Jichoel Bea and
               Hiroyuki Hashimoto and
               Mariappan Murugesan and
               Kang Wook Lee and
               Tetsu Tanaka and
               Kazushi Asami and
               Yasuhiro Kitamura and
               Mitsumasa Koyanagi},
  title     = {Transfer and non-transfer stacking technologies based on chip-to-wafer
               self-asembly for high-throughput and high-precision alignment and
               microbump bonding},
  booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  pages     = {TS7.4.1--TS7.4.4},
  year      = {2015},
  crossref  = {DBLP:conf/3dic/2015},
  url       = {https://doi.org/10.1109/3DIC.2015.7334578},
  doi       = {10.1109/3DIC.2015.7334578},
  timestamp = {Sun, 21 May 2017 00:18:56 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaSHNBHM15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2015,
  title     = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7328029},
  isbn      = {978-1-4673-9385-0},
  timestamp = {Thu, 26 Nov 2015 10:04:17 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2015},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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