BibTeX record conf/3dic/FukushimaBMSSBKLK13

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@inproceedings{DBLP:conf/3dic/FukushimaBMSSBKLK13,
  author    = {Takafumi Fukushima and
               Jichoel Bea and
               Mariappan Murugesan and
               H.{-}Y. Son and
               M.{-}S. Suh and
               K.{-}Y. Byun and
               N.{-}S. Kim and
               Kang Wook Lee and
               Mitsumasa Koyanagi},
  title     = {3D memory chip stacking by multi-layer self-assembly technology},
  booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  pages     = {1--4},
  year      = {2013},
  crossref  = {DBLP:conf/3dic/2013},
  url       = {https://doi.org/10.1109/3DIC.2013.6702360},
  doi       = {10.1109/3DIC.2013.6702360},
  timestamp = {Mon, 26 Nov 2018 17:05:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaBMSSBKLK13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2013,
  title     = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  publisher = {{IEEE}},
  year      = {2013},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6690582},
  isbn      = {978-1-4673-6484-3},
  timestamp = {Mon, 26 Nov 2018 17:05:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2013},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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