BibTeX record conf/3dic/ErogluCL16

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@inproceedings{DBLP:conf/3dic/ErogluCL16,
  author       = {S. E. Kucuk Eroglu and
                  W. Y. Choo and
                  Yusuf Leblebici},
  title        = {Copper TSV-based die-level via-last 3D integration process with parylene-C
                  adhesive bonding technique},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970016},
  doi          = {10.1109/3DIC.2016.7970016},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ErogluCL16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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