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BibTeX record conf/3dic/CioccioGTSBVZVDLABCCC09
@inproceedings{DBLP:conf/3dic/CioccioGTSBVZVDLABCCC09, author = {L{\'{e}}a Di Cioccio and Pierric Gueguen and Rachid Taibi and Thomas Signamarcheix and Laurent Bally and Laurent Vandroux and Marc Zussy and Sophie Verrun and J{\'{e}}r{\^{o}}me Dechamp and Patrick Leduc and Myriam Assous and David Bouchu and Fran{\c{c}}ois de Crecy and Laurent{-}Luc Chapelon and Laurent Clavelier}, title = {An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling}, booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009}, pages = {1--4}, publisher = {{IEEE}}, year = {2009}, url = {https://doi.org/10.1109/3DIC.2009.5306534}, doi = {10.1109/3DIC.2009.5306534}, timestamp = {Wed, 16 Oct 2019 14:14:50 +0200}, biburl = {https://dblp.org/rec/conf/3dic/CioccioGTSBVZVDLABCCC09.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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