BibTeX record conf/3dic/ChengSUCCC15

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@inproceedings{DBLP:conf/3dic/ChengSUCCC15,
  author       = {Chuan{-}An Cheng and
                  Ryuichi Sugie and
                  Tomoyuki Uchida and
                  Kou{-}Hua Chen and
                  Chi{-}Tsung Chiu and
                  Kuan{-}Neng Chen},
  title        = {Electrical investigation of Cu pumping in through-silicon vias for
                  {BEOL} reliability in 3D integration},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.12.1--TS8.12.4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334581},
  doi          = {10.1109/3DIC.2015.7334581},
  timestamp    = {Sat, 19 Oct 2019 20:03:17 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ChengSUCCC15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}