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James W. Joyner

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Journal Articles

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2004
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James W. Joyner, Payman Zarkesh-Ha, James D. Meindl:
Global interconnect design in a three-dimensional system-on-a-chip. IEEE Trans. Very Large Scale Integr. Syst. 12(4): 367-372 (2004)
2001
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James W. Joyner, Raguraman Venkatesan, Payman Zarkesh-Ha, Jeffrey A. Davis, James D. Meindl:
Impact of three-dimensional architectures on interconnects in gigascale integration. IEEE Trans. Very Large Scale Integr. Syst. 9(6): 922-928 (2001)

Conference and Workshop Papers

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2000
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James W. Joyner, Payman Zarkesh-Ha, Jeffrey A. Davis, James D. Meindl:
Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures. SLIP 2000: 123-127

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