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G. Romano
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Conference and Workshop Papers
- 2024
- [c6]Daphnée Bosch, Abygaël Viey, Tadeu Mota Frutuoso, P. Lheritier, C. Licitra, N. Zerhouni, A. Albouy, Laurent Brunet, A. Magalhaes-Lucas, L. M. B. da Silva, H. Boutry, M. Husien Fahmy Taha Abdelrahman, F. Cristiano, R. Gassilloud, M. Ribotta, G. Romano, William Vandendaele, V. Benevent, M. Opprecht, S. Kerdilès, F. Milesi, F. Mazen, Benoit Sklénard, C. Euvrard-Colnat, Johannes Sturm, A. Lambert, C. Candebage, L. Laraignou, F. Boulard, A. Sarrazin, M. De Souza, Christoforos G. Theodorou, Xavier Garros, Perrine Batude:
Breakthrough Processes for Si CMOS Devices with BEOL Compatibility for 3D Sequential Integrated more than Moore Analog Applications. VLSI Technology and Circuits 2024: 1-2 - 2022
- [c5]Tadeu Mota Frutuoso, Xavier Garros, Perrine Batude, Laurent Brunet, Joris Lacord, Benoit Sklénard, V. Lapras, Claire Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, Edoardo Catapano, Mikaël Cassé, Jose Lugo-Alvarez, Philippe Ferrari, Fred Gaillard:
Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration. VLSI Technology and Circuits 2022: 332-333 - 2019
- [c4]Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy:
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC 2019: 1-5 - 2017
- [c3]Jessy Micout, Quentin Rafhay, Xavier Garros, Mikaël Cassé, Jean Coignus, Luca Pasini, Cao-Minh Vincent Lu, Nils Rambal, Claire Fenouillet-Béranger, Laurent Brunet, G. Romano, R. Gassilloud, Perrine Batude, Maud Vinet, Gérard Ghibaudo:
Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices. ESSDERC 2017: 144-147 - 2016
- [c2]Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, Venceslass Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy:
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC 2016: 1-6 - 2014
- [c1]Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. 3DIC 2014: 1-8
Coauthor Index
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