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R. Leroy

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2015
[j2]
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  - journals/mr/JacquesLL15
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Sébastien Jacques, R. Leroy, Marc Lethiecq:
Impact of aluminum wire and ribbon bonding technologies on D²PAK package reliability during thermal cycling applications. Microelectron. Reliab. 55(9-10): 1821-1825 (2015)
2012
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Sébastien Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier:
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. Microelectron. Reliab. 52(1): 212-216 (2012)

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