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ORCIDMichael Glavanovics
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2020 – today
- 2023
[c4]D. Wieland, S. Ofner
, M. Stabentheiner, B. Butej, Christian Koller, J. Sun, Andrea Minetto, K. Reiser, Oliver Häberlen, Michael Nelhiebel, Michael Glavanovics, Dionyz Pogany, Clemens Ostermaier:
A common hard-failure mechanism in GaN HEMTs in accelerated switching and single-pulse short-circuit tests. IRPS 2023: 1-6
2010 – 2019
- 2015
- [c3]Benjamin Steinwender, Michael Glavanovics, Wilfried Elmenreich:
Executable test definition for a state machine driven embedded test controller module. INDIN 2015: 168-173 - 2013
- [c2]Benjamin Steinwender, Sascha Einspieler, Michael Glavanovics, Wilfried Elmenreich:
Distributed power semiconductor stress test & measurement architecture. INDIN 2013: 129-134 - 2012
- [j8]Stefano de Filippis, Helmut Köck, Michael Nelhiebel, Vladimír Kosel, Stefan Decker, Michael Glavanovics, Andrea Irace:
Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices. Microelectron. Reliab. 52(9-10): 2374-2379 (2012) - 2011
- [j7]Olivia Bluder, Michael Glavanovics, Jürgen Pilz:
Applying Bayesian mixtures-of-experts models to statistical description of smart power semiconductor reliability. Microelectron. Reliab. 51(9-11): 1464-1468 (2011) - [j6]Helmut Köck, Christian Djelassi, Stefano de Filippis, Robert Illing, Michael Nelhiebel, Markus Ladurner, Michael Glavanovics, Dionyz Pogany:
Improved thermal management of low voltage power devices with optimized bond wire positions. Microelectron. Reliab. 51(9-11): 1913-1918 (2011) - [j5]Michael Nelhiebel, Robert Illing, Christoph Schreiber, S. Wöhlert, S. Lanzerstorfer, Markus Ladurner, C. Kadow, Stefan Decker, Donald Dibra, H. Unterwalcher, M. Rogalli, W. Robl, T. Herzig, M. Poschgan, M. Inselsbacher, Michael Glavanovics, Sylvain Fraïssé:
A reliable technology concept for active power cycling to extreme temperatures. Microelectron. Reliab. 51(9-11): 1927-1932 (2011) - 2010
- [j4]Vladimír Kosel, Robert Illing, Michael Glavanovics, Alexander Satka:
Non-linear thermal modeling of DMOS transistor and validation using electrical measurements and FEM simulations. Microelectron. J. 41(12): 889-896 (2010)
2000 – 2009
- 2009
- [j3]Helmut Köck, Vladimír Kosel, Christian Djelassi, Michael Glavanovics, Dionyz Pogany:
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures. Microelectron. Reliab. 49(9-11): 1132-1136 (2009) - [c1]Hans-Peter Kreuter, Vladimír Kosel, Michael Glavanovics, Robert Illing:
System level modeling of smart power switches using SystemC-AMS for digital protection concept verification. BMAS 2009: 37-42 - 2007
- [j2]Michael Glavanovics, Helmut Köck, Vladimír Kosel, Tobias Smorodin:
Flexible active cycle stress testing of smart power switches. Microelectron. Reliab. 47(9-11): 1790-1794 (2007) - 2004
- [j1]Thomas Detzel, Michael Glavanovics, Karin Weber:
Analysis of wire bond and metallization degradation mechanisms in DMOS power transistors stressed under thermal overload conditions. Microelectron. Reliab. 44(9-11): 1485-1490 (2004)
Coauthor Index
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