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Bin Liu 0046
Person information
- affiliation: Sun Yat-sen University, School of Biomedical Engineering, Guangzhou, China
- affiliation (PhD 2016): South China University of Technology, School of Mechanical Engineering, Guangzhou, China
Other persons with the same name
- Bin Liu — disambiguation page
- Bin Liu 0001 — Tsinghua University, Department of Computer Science and Technology, Laboratory of Broadband Network Switching Technology and Communications, Beijing, China (and 1 more)
- Bin Liu 0002 — NEC Labs America (and 1 more)
- Bin Liu 0003 — Hunan University of Technology, Department of Information and Computing Science, Zhuzhou, China (and 1 more)
- Bin Liu 0004 — Samsung (and 1 more)
- Bin Liu 0005 — GLC Asset Management (and 1 more)
- Bin Liu 0006 — University of California, Los Angeles, CA, USA
- Bin Liu 0007 — EDA Lab, Department of Computer Science and Technology, Tsinghua University
- Bin Liu 0008 — Information Engineering University, China
- Bin Liu 0009 — Ocean University of China, Department of Mathematics, Qingdao, China (and 1 more)
- Bin Liu 0010 — Georgia Institute of Technology
- Bin Liu 0011 — Henan Agricultural University, Department of Management Science, Zhengzhou, China (and 1 more)
- Bin Liu 0012 — Telecom ParisTech, France
- Bin Liu 0013 — Huazhong University of Science and Technology
- Bin Liu 0014 — Beijing Institute of Technology, School of Computer Science and Technology, Beijing, China (and 3 more)
- Bin Liu 0015 — State Key Laboratory of Intelligent Technology and Systems, Department of Automation, Tsinghua University
- Bin Liu 0016 — University of Science and Technology of China, School of Information and Technology, Hefei, China (and 1 more)
- Bin Liu 0017 — Carnegie Mellon University, Pittsburgh, PA, USA
- Bin Liu 0018 — Tongji University, Shanghai, China
- Bin Liu 0019 — Shanghai Ocean University, China (and 1 more)
- Bin Liu 0021 — Nanjing University of Posts and Telecommunications, School of Computer Science and Technology, China
- Bin Liu 0022 — Southwestern University of Finance and Economics, Center of Statistical Research, China (and 1 more)
- Bin Liu 0023 — Northwest A&F University, Yangling, China (and 1 more)
- Bin Liu 0024 — Northwestern Polytechnical University, Department of Applied Mathematics, Xi'an, China (and 1 more)
- Bin Liu 0025 — University of Strathclyde, Department of Management Science, Glasgow, UK (and 2 more)
- Bin Liu 0026 — National University of Defense Technology, Science and Technology on Information System and Engineering Laboratory, Changsha, China
- Bin Liu 0027 — Chongqing University, College of Computer Science, China (and 1 more)
- Bin Liu 0028 — KU Leuven, Belgium (and 1 more)
- Bin Liu 0029 — Hubei University, School of Computer and Information Engineering, Wuhan, China
- Bin Liu 0030 — University of Wollongong, School of Electrical, Computer and Telecommunications Engineering, NSW, Australia
- Bin Liu 0031 — Harbin Engineering University, College of Information and Communication Engineering, China
- Bin Liu 0032 — Beihang University, School of Reliability and Systems Engineering, Beijing, China
- Bin Liu 0033 — Chengdu University of Technology, College of Management Science, China (and 1 more)
- Bin Liu 0034 — Air Force Engineering University, Xi'an, China
- Bin Liu 0035 — Tsinghua University, School of Software, Beijing, China (and 1 more)
- Bin Liu 0036 — University of New South Wales, School of Electrical and Information Engineering, Sydney, Australia (and 1 more)
- Bin Liu 0037 — University of California, Davis, Department of Electrical and Computer Engineering, CA, USA
- Bin Liu 0038 — University of Shanghai for Science and Technology, China (and 1 more)
- Bin Liu 0039 — North University of China, Shanxi Key Laboratory of Information Survey and Processing, Taiyuan, China
- Bin Liu 0040 — Dalian University of Technology, International School of Information Science & Engineering (DUT-RUISE), Dalian, China (and 1 more)
- Bin Liu 0041 — Chinese Academy of Sciences, Institute of Automation, National Laboratory of Pattern Recognition, Beijing, China
- Bin Liu 0042 — Shenyang University of Technology, School of Information Science and Engineering, China
- Bin Liu 0043 — Southeast University, Zhong-Da Hospital, Department of Radiology, Nanjing, China
- Bin Liu 0044 — Yanshan University, School of Information Science and Engineering, Qinhuangdao, China
- Bin Liu 0045 — West Virginia University, Morgantown, WV, USA (and 2 more)
- Bin Liu 0047 — Shandong University, School of Qilu Transportation / Geotechnical and Structural Engineering Research Center, Jinan, China
- Bin Liu 0048 — Nanchang Hangkong University, MoE Key Laboratory of Nondestructive Test / National Engineering Laboratory for Destructive Testing and Optoelectronic Sensing Technology and Application, China
- Bin Liu 0049 — Chinese Academy of Sciences, Aerospace Information Research Institute / Institute of Remote Sensing Applications, State Key Laboratory of Remote Sensing Science, Beijing, China (and 1 more)
- Bin Liu 0050 — Nanyang Technological University, Division of Mathematical Sciences, Singapore (and 1 more)
- Bin Liu 0051 — Huazhong University of Science and Technology, School of Mathematics and Statistics, Wuhan, China
- Bin Liu 0052 — Nanjing Medical University, School of Biomedical Engineering and Informatics, Key Laboratory of Clinical and Medical Engineering, China (and 1 more)
- Bin Liu 0053 — Guangxi University, School of Electrical Engineering, Nanning, China (and 1 more)
- Bin Liu 0054 — Shanghai Jiao Tong University, School of Electronic Information and Electrical Engineering, China
- Bin Liu 0055 — Jiangsu University, School of Finance and Economics, Zhenjiang, China
- Bin Liu 0056 — Nanjing University of Posts and Telecommunications, School of Telecommunication and Information Engineering, China
- Bin Liu 0057 — Nanchang Hangkong University, School of Mathematics and Information Sciences, China (and 1 more)
- Bin Liu 0058 — Chongqing University of Posts and Telecommunications, Chongqing, China (and 1 more)
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2020 – today
- 2020
- [j3]Lei Ren, Zhipeng Chen, Hongjian Wang, Zulin Dou, Bin Liu, Lelun Jiang:
Fabrication of Bendable Microneedle-Array Electrode by Magnetorheological Drawing Lithography for Electroencephalogram Recording. IEEE Trans. Instrum. Meas. 69(10): 8328-8334 (2020)
2010 – 2019
- 2018
- [j2]Lei Ren, Shujia Xu, Jie Gao, Zi Lin, Zhipeng Chen, Bin Liu, Liang Liang, Lelun Jiang:
Fabrication of Flexible Microneedle Array Electrodes for Wearable Bio-Signal Recording. Sensors 18(4): 1191 (2018) - [j1]Yiwei Sun, Lei Ren, Lelun Jiang, Yong Tang, Bin Liu:
Fabrication of Composite Microneedle Array Electrode for Temperature and Bio-Signal Monitoring. Sensors 18(4): 1193 (2018)
Coauthor Index
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last updated on 2024-11-05 22:05 CET by the dblp team
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