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Dennis P. Bouldin

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1990 – 1999

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1995
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Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin:
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM J. Res. Dev. 39(4): 465-498 (1995)

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