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Samuel d'Hollosy

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2021
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  - https://dblp.org/rec/conf/irps/SchmidgallGTPYS21
Emma R. Schmidgall, Flavio Griggio, George H. Thiel, Sherman E. Peek, Bhargav Yelamanchili, Archit Shah, Vaibhav Gupta, John A. Sellers, Michael C. Hamilton, David B. Tuckerman, Samuel d'Hollosy:
Reliability Characterization of a Flexible Interconnect for Cryogenic and Quantum Applications. IRPS 2021: 1-7

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