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Allison T. Osmanson

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Conference and Workshop Papers

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2021
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Allison T. Osmanson, Mohsen Tajedini, Yi Ram Kim, Hossein Madanipour, Choong-Un Kim, Bradley Glasscock, Muhammad Khan:
Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages. IRPS 2021: 1-6
2020
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Yi Ram Kim, Allison T. Osmanson, Hossein Madanipour, Choong-Un Kim, Patrick F. Thompson, Qiao Chen:
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects. IRPS 2020: 1-5

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