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K. J. Rhee

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2003
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Yong-Ha Song, S. G. Kim, S. B. Lee, K. J. Rhee, T. S. Kim:
A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology. Microelectron. Reliab. 43(9-11): 1405-1410 (2003)

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