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Herbert Struyf

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Conference and Workshop Papers

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2014
[c1]
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Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka:
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 3DIC 2014: 1-4

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