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2020 – today
- 2023
[j5]Cory Marquez, Jesus J. Mata, Anabel Renteria, Diego González, Sofia Gabriela Gomez
, Alexis Lopez, Annette N. Baca, Alan Nuñez, Md Sahid Hassan, Vincent Burke, Dina Perlasca, Yifeng Wang, Yongliang Xiong, Jessica N. Kruichak, David Espalin, Yirong Lin:
Direct Ink-Write Printing of Ceramic Clay with an Embedded Wireless Temperature and Relative Humidity Sensor. Sensors 23(6): 3352 (2023)
2010 – 2019
- 2019
- [j4]Kazi Md Masum Billah, Jose L. Coronel, Michael C. Halbig, Ryan B. Wicker, David Espalin:
Electrical and Thermal Characterization of 3D Printed Thermoplastic Parts With Embedded Wires for High Current-Carrying Applications. IEEE Access 7: 18799-18810 (2019) - 2018
- [j3]Callum Bailey, Efrain Aguilera, David Espalin, Jose Motta, Alfonso Fernández, Mireya A. Perez, Christopher Dibiasio, Dariusz Pryputniewicz, Eric W. MacDonald, Ryan B. Wicker:
Augmenting Computer-Aided Design Software With Multi-Functional Capabilities to Automate Multi-Process Additive Manufacturing. IEEE Access 6: 1985-1994 (2018) - 2017
- [j2]Chiyen Kim, David Espalin, Min Liang, Hao Xin, Alejandro Cuaron, Issac Varela, Eric W. MacDonald, Ryan B. Wicker:
3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect. IEEE Access 5: 25286-25294 (2017) - 2015
- [c1]Chiyen Kim, David Espalin, Alejandro Cuaron, Mireya A. Perez, Eric W. MacDonald, Ryan B. Wicker:
A study to detect a material deposition status in fused deposition modeling technology. AIM 2015: 779-783 - 2014
- [j1]Eric W. MacDonald, Rudy Salas, David Espalin, Mireya Perez, Efrain Aguilera, Dan Muse, Ryan B. Wicker:
3D Printing for the Rapid Prototyping of Structural Electronics. IEEE Access 2: 234-242 (2014)
Coauthor Index
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