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Yassir Madhour

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Conference and Workshop Papers

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2013
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Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel:
Integration of intra chip stack fluidic cooling using thin-layer solder bonding. 3DIC 2013: 1-8
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Arvind Sridhar, Yassir Madhour, David Atienza, Thomas Brunschwiler, John Richard Thome:
STEAM: a fast compact thermal model for two-phase cooling of integrated circuits. ICCAD 2013: 256-263

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