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Loïc Sanchez
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Conference and Workshop Papers
- 2021
- [c8]Claire Besancon, Delphine Néel, Joan Ramirez, David Bitauld, Giancarlo Cerulo, Dalila Make, Nicolas Vaissiere, Frédéric Pommereau, Frank Fournel, Loic Sanchez, Cécilia Dupré, Viviane Muffato, Karim Hassan, Jean Decobert:
AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs. OFC 2021: 1-3 - 2019
- [c7]Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy:
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC 2019: 1-5 - [c6]Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger:
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. 3DIC 2019: 1-7 - 2018
- [c5]Sylvie Menezo, Torrey Thiessen, Philippe Grosse, Joyce K. S. Poon, Christophe Jany, Jeremy Da Fonseca, Bertrand Szelag, Benoît Charbonnier, Georgio El-Zammar, Olivier Lemonnier, Patricia Bilondeau, Stephane Malhouitre, Brigitte Montmayeul, Loic Sanchez:
High-Speed Heterogeneous InP-on-Si Capacitive Phase Modulators. OFC 2018: 1-3 - 2015
- [c4]Helene Duprez, Antoine Descos, Thomas Ferrotti, Julie Harduin, Christophe Jany, T. Card, A. Myko, Loic Sanchez, Corrado Sciancalepore, Sylvie Menezo, Badhise Ben Bakir:
Heterogeneously integrated III-V on silicon distributed feedback lasers at 1310 nm. OFC 2015: 1-3 - 2013
- [c3]Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry:
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC 2013: 1-7 - 2011
- [c2]Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny:
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. 3DIC 2011: 1-5 - [c1]Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot:
3D monolithic integration. ISCAS 2011: 2233-2236
Coauthor Index
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