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ORCIDSheng Liu 0016
Person information
- affiliation: Wuhan University, Institute of Technological Sciences, China
- affiliation (2004 - 2013): Huazhong University of Science and Technology, Institute of Microsystems, School of Mechanical Science and Engineering, Wuhan, China
- affiliation (1995 - 2003): Wayne State University, Institute for Manufacturing Research, School of Mechanical Engineering, Detroit, MI, USA
- affiliation (1992 - 1995): Florida Institute of Technology, School of Mechanical and Aerospace Engineering, Melbourne, FL, USA
- affiliation (PhD 1992): Stanford University, School of Mechanical Engineering, CA, USA
Other persons with the same name
- Sheng Liu — disambiguation page
- Sheng Liu 0001 — National University of Defense Technology, School of Computer, Changsha, China
- Sheng Liu 0002
![[0000-0001-8082-0903]](https://dblp1.uni-trier.de/img/orcid-mark.12x12.png "0000-0001-8082-0903")
— Zhejiang University of Technology, College of Computer Science and Technology, Hangzhou, China - Sheng Liu 0003 — Chinese Academy of Sciences, Institute of Automation, State Key Laboratory of Management and Control for Complex Systems, Beijing, China (and 2 more)
- Sheng Liu 0004 — South China Normal University, Laboratory of Quantum Engineering and Quantum Materials, Guangzhou, China
- Sheng Liu 0005 — Huaibei Normal University, College of Computer Science and Technology, China (and 1 more)
- Sheng Liu 0006 — University of California Berkeley, Department of Industrial Engineering and Operations Research, CA, USA
- Sheng Liu 0007 — Shanghai University of Engineering Science, School of Management, Shanghai, China (and 1 more)
- Sheng Liu 0008 — Xiangtan University, School of Automation and Electronic Information, China
- Sheng Liu 0009 — Beihang University, School of Computer Science and Engineering, State Key Laboratory of Virual Reality Technology and Systems, Beijing, China (and 1 more)
- Sheng Liu 0010 — China University of Geosciences, School of Geophysics and Information Technology, Beijing, China
- Sheng Liu 0011 — Harbin Engineering University, College of Intelligent Systems Science and Engineering, China
- Sheng Liu 0012 — China Medical University, Shenyang, China
- Sheng Liu 0013 — Nanjing University, School of Electronic Science and Engineering, China
- Sheng Liu 0014 — Shanghai University of Engineering Science, School of Management, China
- Sheng Liu 0015 — University of New Mexico, Department of Physics and Astronomy, Albuquerque, NM, USA
- Sheng Liu 0017 — State University of New York at Buffalo, Department of Computer Science and Engineering, NY, USA
- Sheng Liu 0018 — Wuhan University, Institute of Technological Sciences, China
- Sheng Liu 0019 — Xi'an University of Technology, School of Computer Science and Engineering, China (and 1 more)
- Sheng Liu 0020 — Chinese Academy of Sciences, Hefei Institutes of Physical Science, Institute of Plasma Physics, China
- Sheng Liu 0021 — Shanghai Jiao Tong University, Shanghai Key Laboratory of Digital Manufacture for Thin-walled Structures, China
- Sheng Liu 0022 — BGI, China
- Sheng Liu 0023 — KTH Royal Institute of Technology, Sweden (and 1 more)
- Sheng Liu 0024 — Zhejiang University, College of Electrical Engineering, Hangzhou, China
- Sheng Liu 0025 — Hunan University, School of Computer Science and Electronic Engineering, Changsha, China
- Sheng Liu 0026 — Nanchang Institute of Technology, College of Business Adminstration, China
- Sheng Liu 0027 — National University of Defense Technology, Changsha, China
- Sheng Liu 0028 — Chinese Academy of Sciences, Shanghai Institute of Nutrition and Health, CAS Key Laboratory of Computational Biology, China
- Sheng Liu 0029 — Tsinghua University, Department of Electronic Engineering, Beijing, China
- Sheng Liu 0030 — Beijing Institute of Technology, School of Information and Electronics, Radar Research Lab, China
- Sheng Liu 0031 — Zhejiang University, College of Electrical Engineering, Hangzhou, China
- Sheng Liu 0032 — General Motors Global R&D, Warren, MI, USA (and 1 more)
- Sheng Liu 0033 — University of Electronic Science and Technology of China, School of Mathematical Sciences, Chengdu, China
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2020 – today
- 2025
[j15]Zihan Yang, Xiangyu Lu, Junlai Zhao, Wei Wang, Chen Zhang, Jianhui Zhao, Jiachen Yu, Sheng Liu, Fang Dong:
Industrial Camera-Based Powder Bed Defect Detection in Laser Powder Bed Fusion: Dataset Construction and Model Evaluation. IEEE Access 13: 58175-58190 (2025)- [j14]Tianjian Liu, Jie Wu, Zhen Chen, Shujuan Liu, Zhongkai Jiang, Haoyang Peng, Zhandi Yang, Xing Hu, Dong Xie, Fang Dong, Yiqun Wang, Sheng Liu:
Thermal Perspective Design and Analysis of Multi-Stacked Structures. IEEE J. Emerg. Sel. Topics Circuits Syst. 15(3): 438-444 (2025) - [j13]Yi Gong, Xiangli Li, Rui Zhou, Miao Li, Sheng Liu:
A robotized framework for real-time detection and in-situ repair of manufacturing defects in CFRP patch placement. Robotics Comput. Integr. Manuf. 92: 102882 (2025) - [j12]Bo Ye, Zhi Shu, Shufang Wang, Bo Wang, Guangzheng Gao, Shoujun Dai, Sixian Liu, Yihan Xu, Princy Randhawa, Lalit Garg, Amit Krishna Dwivedi, Sheng Liu:
Design and Control of a Dual-Drug-Chamber Drug Delivery Capsule Robot for Multi-Target Drug Delivery. IEEE Trans Autom. Sci. Eng. 22: 20759-20769 (2025) - [j11]Xiaoxiao Li, Taobo Hu, Zhengxiong Li, Mengping Long, Zhaoyi Ye, Jin Huang, Yaxiaer Yalikun, Sheng Liu, Yiqiang Liu, Du Wang, Jianghua Wu, Liye Mei, Cheng Lei:
MRRM: Advanced Biomarker Alignment in Multi-Staining Pathology Images via Multi-Scale Ring Rotation-Invariant Matching. IEEE J. Biomed. Health Informatics 29(2): 1189-1198 (2025) - [j10]Jin Huang, Yazhao Mao, Jingwen Deng, Zhaoyi Ye, Yimin Zhang, Jingwen Zhang, Lan Dong, Hui Shen, Jinxuan Hou, Yu Xu, Xiaoxiao Li, Sheng Liu, Du Wang, Shengrong Sun, Liye Mei, Cheng Lei:
EMGANet: Edge-Aware Multi-Scale Group-Mix Attention Network for Breast Cancer Ultrasound Image Segmentation. IEEE J. Biomed. Health Informatics 29(8): 5631-5641 (2025) - 2024
- [j9]Xiao Zhang, Xun Liu, Yifan Song, Xuehan Li, Wei Huang, Yang Zhou, Sheng Liu:
Digital-Twin-Driven Intelligent Insulated-Gate Bipolar Transistor Production Lines. Sensors 24(2): 612 (2024) - [j8]Kun Ma, Yameng Sun, Xun Liu, Yifan Song, Xuehan Li, Huimin Shi, Zheng Feng, Xiao Zhang, Yang Zhou, Sheng Liu:
The Mechanism of Short-Circuit Oscillations in Automotive-Grade Multi-Chip Parallel Power Modules and an Effective Mitigation Approach. Sensors 24(9): 2858 (2024) - [j7]Chuan Xu, Zhaoyi Ye, Liye Mei, Haonan Yu, Jianchen Liu, Yaxiaer Yalikun, Shuangtong Jin, Sheng Liu, Wei Yang, Cheng Lei:
Hybrid Attention-Aware Transformer Network Collaborative Multiscale Feature Alignment for Building Change Detection. IEEE Trans. Instrum. Meas. 73: 1-14 (2024) - [j6]Bo Ye, Zhi Shu, Bo Wang, Shufang Wang, Yingbing Fu, Leting Zhang, Bowen Qi, Amit Krishna Dwivedi, Sheng Liu:
Attention Mechanism Guided SE + ResNet-H Model for Gastrointestinal Endoscopy Image Classification. IEEE Trans. Instrum. Meas. 73: 1-13 (2024) - [j5]Xiaoxiao Li, Zhengxiong Li, Taobo Hu, Mengping Long, Xiao Ma, Jin Huang, Yiqiang Liu, Yaxiaer Yalikun, Sheng Liu, Du Wang, Jianghua Wu, Liye Mei, Cheng Lei:
MSGM: An Advanced Deep Multi-Size Guiding Matching Network for Whole Slide Histopathology Images Addressing Staining Variation and Low Visibility Challenges. IEEE J. Biomed. Health Informatics 28(10): 6019-6030 (2024) - 2022
- [j4]Lei Shi, Licheng Jia, Chongbin Liu, Chengliang Sun, Sheng Liu, Guoqiang Wu:
A Miniaturized Ultrasonic Sugar Concentration Detection System Based on Piezoelectric Micromachined Ultrasonic Transducers. IEEE Trans. Instrum. Meas. 71: 1-9 (2022) - 2021
- [j3]Jun Yang, Panpan Zheng, Xiaogang Liu, Qinglin Song, Yingfeng Zhu, Bin Song, Xiaoping Wang, Sheng Liu:
Failure Analysis of Aluminum Wire Bonds in Automotive Pressure Sensors in Thermal Shock Environments. IEEE Access 9: 109548-109557 (2021) - 2020
- [j2]Xiaoping Wang, Zhiwen Chen, Wan Cao, Guoliang Xu, Li Liu, Sheng Liu, Honglang Li, Xunqing Shi, Qinglin Song, Zhiyi Xiao, Chao Sun:
Artificial Neural Network-Based Method for Identifying Under-Inflated Tire in Indirect TPMS. IEEE Access 8: 213799-213805 (2020)
2010 – 2019
- 2016
- [j1]Ling Xu, Miaocao Wang, Yang Zhou, Zhengfang Qian, Sheng Liu:
An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling. Microelectron. Reliab. 56: 101-108 (2016)
Coauthor Index
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last updated on 2025-10-10 00:04 CEST by the dblp team
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