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Mariappan Murugesan

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Hideto Hashiguchi

> Home > Persons > Mariappan Murugesan

Publications

2016
[j2]
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  dblp key:
  - journals/micromachines/FukushimaHYKMBL16
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  persistent URL:
  - https://dblp.org/rec/journals/micromachines/FukushimaHYKMBL16
Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi:
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 7(10): 184 (2016)
2015
[c17]
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  dblp key:
  - conf/3dic/FukushimaSHNBHM15
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/FukushimaSHNBHM15
Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi:
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. 3DIC 2015: TS7.4.1-TS7.4.4
2011
[c6]
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  - conf/3dic/MurugesanHKFTK11
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  - https://dblp.org/rec/conf/3dic/MurugesanHKFTK11
Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. 3DIC 2011: 1-4

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