Jaewon Kim

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Young-Chang Joo

> Home > Persons > Jaewon Kim

Publications

2011
[c22]
- no documents available
  - no references & citations available
- export record
  dblp key:
  - conf/biostec/JeongKKPKJ11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/biostec/JeongKKPKJ11
Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo:
Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. BIODEVICES 2011: 311-314

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.