Hung-Chih Lin

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Hao Chen 0053

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Publications

2017
[j8]
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Kai-Li Wang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang:
Test Cost Reduction Methodology for InFO Wafer-Level Chip-Scale Package. IEEE Des. Test 34(3): 50-58 (2017)
[c19]
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  - conf/itc-asia/ChenLW17
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Hao Chen, Hung-Chih Lin, Min-Jer Wang:
Fan-out wafer level chip scale package testing. ITC-Asia 2017: 84-89
2016
[c16]
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  - conf/dac/HuangLWLCLPW16
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Yu-Chieh Huang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang:
Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package. DAC 2016: 58:1-58:6
2014
[c14]
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  - conf/itc/ChenLPW14
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Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang:
Wafer Level Chip Scale Package copper pillar probing. ITC 2014: 1-6
[c12]
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  - conf/vlsi-dat/LeeAWPLHC14
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Mincent Lee, Saman Adham, Min-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Hao Chen:
A novel DFT architecture for 3DIC test, diagnosis and repair. VLSI-DAT 2014: 1-4
2013
[c11]
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  - conf/itc/HsuCHLLLPW13
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Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang:
Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch. ITC 2013: 1-10
2012
[c8]
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  - conf/itc/WuCLLWTLCPW12
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Tze-Hsin Wu, Po-Yuan Chen, Mincent Lee, Bin-Yen Lin, Cheng-Wen Wu, Chen-Hung Tien, Hung-Chih Lin, Hao Chen, Ching-Nen Peng, Min-Jer Wang:
A memory yield improvement scheme combining built-in self-repair and error correction codes. ITC 2012: 1-9

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