Fei Lu 0004

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Chen Zhang 0017

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Publications

2016
[j2]
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Fei Lu, Rui Ma, Zongyu Dong, Li Wang, Chen Zhang, Chenkun Wang, Qi Chen, X. Shawn Wang, Feilong Zhang, Cheng Li, He Tang, Yuhua Cheng, Albert Z. Wang:
A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS. IEEE Trans. Circuits Syst. I Regul. Pap. 63-I(10): 1746-1757 (2016)
2015
[c6]
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  - conf/asicon/WangM0WDWZZFT15
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Li Wang, Rui Ma, Fei Lu, Albert Z. Wang, Zongyu Dong, Xin Wang, Chen Zhang, Bin Zhao, Siqiang Fan, He Tang:
Function-based ESD protection circuit design verification for BGA pad-ring array. ASICON 2015: 1-4
2014
[j1]
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  - journals/jssc/WangWLZDWMSWCWJY14
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X. Shawn Wang, Xin Wang, Fei Lu, Chen Zhang, Zongyu Dong, Li Wang, Rui Ma, Zitao Shi, Albert Z. Wang, Mau-Chung Frank Chang, Dawn Wang, Alvin J. Joseph, C. Patrick Yue:
Concurrent Design Analysis of High-Linearity SP10T Switch With 8.5 kV ESD Protection. IEEE J. Solid State Circuits 49(9): 1927-1941 (2014)
[c4]
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  - conf/iscas/WangMZDLWWLFTCWR14
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Li Wang, Rui Ma, Chen Zhang, Zongyu Dong, Fei Lu, Albert Z. Wang, Xin Wang, Jian Liu, Siqiang Fan, He Tang, Baoyong Chi, Liji Wu, Tianling Ren:
Scalable behavior modeling for SCR based ESD protection structures for circuit simulation. ISCAS 2014: 2333-2336
2013
[c2]
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  - conf/cicc/WangWSMZDLZW13
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Li Wang, Xin Wang, Zitao Shi, Rui Ma, Chen Zhang, Zongyu Dong, Fei Lu, Hui Zhao, Albert Z. Wang:
Scalable behavior modeling for 3D field-programmable ESD protection structures. CICC 2013: 1-4
[c1]
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  - conf/islped/WangMZDWSLLZLFYZRLHW13
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Li Wang, Rui Ma, Chen Zhang, Zongyu Dong, Xin Wang, Zitao Shi, Jian Liu, Lin Lin, Hui Zhao, Fei Lu, Qiang Fang, Chen Yang, Jing Zhan, Tianling Ren, Xinxin Li, Ru Huang, Albert Z. Wang:
Heterogeneous integration of nano enabling devices for 3D ICs. ISLPED 2013: 249-254

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