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Shi-Yu Huang
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Publications
- 2020
- [j48]Mason Chern, Shih-Wei Lee, Shi-Yu Huang, Yu Huang, Gaurav Veda, Kun-Han Tsai, Wu-Tung Cheng:
Diagnosis of Intermittent Scan Chain Faults Through a Multistage Neural Network Reasoning Process. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(10): 3044-3055 (2020) - 2019
- [c72]Mason Chern, Shih-Wei Lee, Shi-Yu Huang, Yu Huang, Gaurav Veda, Kun-Han Hans Tsai, Wu-Tung Cheng:
Improving scan chain diagnostic accuracy using multi-stage artificial neural networks. ASP-DAC 2019: 341-346 - 2018
- [j45]Shaofu Yang, Zhi-Yuan Wen, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng:
Circuit and Methodology for Testing Small Delay Faults in the Clock Network. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(10): 2087-2097 (2018) - 2016
- [j44]Shi-Yu Huang, Meng-Ting Tsai, Kun-Han Tsai, Wu-Tung Cheng:
Delay Characterization and Testing of Arbitrary Multiple-Pin Interconnects. IEEE Des. Test 33(2): 9-16 (2016) - [j43]Shi-Yu Huang, Chih-Chieh Cheng, Meng-Ting Tsai, Kuan-Chen Huang, Kun-Han Tsai, Wu-Tung Cheng:
Versatile Transition-Time Monitoring for Interconnects via Distributed TDC. IEEE Des. Test 33(6): 23-30 (2016) - [c58]Shaofu Yang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng:
Testing of small delay faults in a clock network. ETS 2016: 1-6 - [c57]Shi-Yu Huang, Tzu-Heng Huang, Kun-Han Tsai, Wu-Tung Cheng:
A wide-range clock signal generation scheme for speed grading of a logic core. HPCS 2016: 125-129 - [c55]Chih-Chieh Zheng, Shi-Yu Huang, Shyue-Kung Lu, Ting-Chi Wang, Kun-Han Tsai, Wu-Tung Cheng:
Online slack-time binning for IO-registered die-to-die interconnects. ITC 2016: 1-8 - 2015
- [j42]Shi-Yu Huang, Meng-Ting Tsai, Zeng-Fu Zeng, Kun-Han Hans Tsai, Wu-Tung Cheng:
General Timing-Aware Built-In Self-Repair for Die-to-Die Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(11): 1836-1846 (2015) - [j41]Shi-Yu Huang, Meng-Ting Tsai, Hua-Xuan Li, Zeng-Fu Zeng, Kun-Han Hans Tsai, Wu-Tung Cheng:
Nonintrusive On-Line Transition-Time Binning and Timing Failure Threat Detection for Die-to-Die Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(12): 2039-2048 (2015) - [c52]Shi-Yu Huang, Meng-Ting Tsai, Kun-Han Hans Tsai, Wu-Tung Cheng:
Feedback-bus oscillation ring: a general architecture for delay characterization and test of interconnects. DATE 2015: 924-927 - [c51]Meng-Ting Tsai, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng:
Monitoring the delay of long interconnects via distributed TDC. ITC 2015: 1-9 - 2014
- [j38]Li-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng:
Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(3): 476-488 (2014) - [j37]Shi-Yu Huang, Jeo-Yen Lee, Kun-Han Tsai, Wu-Tung Cheng:
Pulse-Vanishing Test for Interposers Wires in 2.5-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(8): 1258-1268 (2014) - [c50]Shi-Yu Huang, Hua-Xuan Li, Zeng-Fu Zeng, Kun-Han Tsai, Wu-Tung Cheng:
On-Line Transition-Time Monitoring for Die-to-Die Interconnects in 3D ICs. ATS 2014: 162-167 - [c49]Shi-Yu Huang, Zeng-Fu Zeng, Kun-Han Tsai, Wu-Tung Cheng:
On-the-fly timing-aware built-in self-repair for high-speed interposer wires in 2.5-D ICs. ETS 2014: 1-2 - 2013
- [j35]Yu-Hsiang Lin, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter, Yung-Fa Chou, Ding-Ming Kwai:
Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(5): 737-747 (2013) - [j34]Shi-Yu Huang, Yu-Hsiang Lin, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng:
Programmable Leakage Test and Binning for TSVs With Self-Timed Timing Control. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(8): 1265-1273 (2013) - [j33]Li-Ren Huang, Shi-Yu Huang, Stephen K. Sunter, Kun-Han Tsai, Wu-Tung Cheng:
Oscillation-Based Prebond TSV Test. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(9): 1440-1444 (2013) - [c48]Li-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter:
Mid-bond Interposer Wire Test. Asian Test Symposium 2013: 153-158 - [c47]Shi-Yu Huang, Jeo-Yen Lee, Kun-Han Tsai, Wu-Tung Cheng:
At-speed BIST for interposer wires supporting on-the-spot diagnosis. IOLTS 2013: 67-72 - [c46]Shi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng:
Delay testing and characterization of post-bond interposer wires in 2.5-D ICs. ITC 2013: 1-8 - 2012
- [c44]Yu-Hsiang Lin, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng:
Programmable Leakage Test and Binning for TSVs. Asian Test Symposium 2012: 43-48 - [c43]Shi-Yu Huang, Yu-Hsiang Lin, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter, Yung-Fa Chou, Ding-Ming Kwai:
Small delay testing for TSVs in 3-D ICs. DAC 2012: 1031-1036 - [c42]Yu-Hsiang Lin, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter:
A unified method for parametric fault characterization of post-bond TSVs. ITC 2012: 1-10
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