Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

Armando W. Colombo

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Daniel Cachapa

> Home > Persons > Armando W. Colombo

Publications

2012
[j12]
- view
  authority control:
- export record
  dblp key:
  - journals/jim/LeitaoMBCCR12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jim/LeitaoMBCCR12
Paulo Leitão, J. Marco Mendes, Axel Bepperling, Daniel Cachapa, Armando W. Colombo, Francisco J. Restivo:
Integration of virtual and real environments for engineering service-oriented manufacturing systems. J. Intell. Manuf. 23(6): 2551-2563 (2012)
2010
[c20]
- view
  - electronic edition via DOI (open access)
  - references & citations
  authority control:
- export record
  dblp key:
  - conf/ifip5-5/CachapaHC10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ifip5-5/CachapaHC10
Daniel Cachapa, Robert Harrison, Armando W. Colombo:
Improving Energy Efficiency in the Production Floor Using SoA-Based Monitoring Techniques. DoCEIS 2010: 159-166
2007
[c10]
- view
  authority control:
- export record
  dblp key:
  - conf/etfa/CachapaCFB07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/etfa/CachapaCFB07
Daniel Cachapa, Armando W. Colombo, Martin Feike, Axel Bepperling:
An approach for integrating real and virtual production automation devices applying the service-oriented architecture paradigm. ETFA 2007: 309-314

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.