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Eva Leong-Ching Wai

Leong Ching Wai

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affiliation: A*STAR, Singapore

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2010 – 2019

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2019
[j5]
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Guoqiang Wu, Beibei Han, Daw Don Cheam, Leong Ching Wai, Peter Hyun Kee Chang, Navab Singh, Yuandong Gu:
Development of Six-Degree-of-Freedom Inertial Sensors With an 8-in Advanced MEMS Fabrication Platform. IEEE Trans. Ind. Electron. 66(5): 3835-3842 (2019)
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Jinghui Xu, Kevin Tshun-Chuan Chai, Guoqiang Wu, Beibei Han, Eva Leong-Ching Wai, Wei Li, Jason Yeo, Edwin Nijhof, Yuandong Gu:
Low-Cost, Tiny-Sized MEMS Hydrophone Sensor for Water Pipeline Leak Detection. IEEE Trans. Ind. Electron. 66(8): 6374-6382 (2019)
2012
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A. D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai:
Modular sensor chip design for package stress evaluation and reliability characterisation. Microelectron. Reliab. 52(8): 1581-1585 (2012)
2010
[j2]
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  - journals/mr/OngHVSJLSWROOZSLLYCYTS10
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Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn:
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. Microelectron. Reliab. 50(7): 986-994 (2010)

2000 – 2009

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2009
[j1]
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Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen:
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectron. Reliab. 49(2): 150-162 (2009)

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