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M. John Interrante

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2000 – 2009

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2008
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Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker:
3D chip stacking with C4 technology. IBM J. Res. Dev. 52(6): 599-609 (2008)

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