BibTeX records: Jeroen J. M. Zaal

• > Home > Persons > Jeroen J. M. Zaal

@article{DBLP:journals/mr/MavinkurveMSZ16,
  author       = {Amar Mavinkurve and
                  Jaume L. M. Llacer Martinez and
                  Michiel van Soestbergen and
                  Jeroen J. M. Zaal},
  title        = {Moisture absorption by molding compounds under extreme conditions:
                  Impact on accelerated reliability tests},
  journal      = {Microelectron. Reliab.},
  volume       = {64},
  pages        = {254--258},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.microrel.2016.07.105},
  doi          = {10.1016/J.MICROREL.2016.07.105},
  timestamp    = {Wed, 23 Mar 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/MavinkurveMSZ16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/HochstenbachDYZB10,
  author       = {Hendrik Pieter Hochstenbach and
                  Willem D. van Driel and
                  Dao{-}Guo Yang and
                  Jeroen J. M. Zaal and
                  E. Bagerman},
  title        = {Designing for reliability using a new Wafer Level Package structure},
  journal      = {Microelectron. Reliab.},
  volume       = {50},
  number       = {4},
  pages        = {528--535},
  year         = {2010},
  url          = {https://doi.org/10.1016/j.microrel.2009.09.011},
  doi          = {10.1016/J.MICROREL.2009.09.011},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/HochstenbachDYZB10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/sensors/ZaalDZ10,
  author       = {Jeroen J. M. Zaal and
                  Willem D. van Driel and
                  G. Q. Zhang},
  title        = {Challenges in the Assembly and Handling of Thin Film Capped {MEMS}
                  Devices},
  journal      = {Sensors},
  volume       = {10},
  number       = {4},
  pages        = {3989--4001},
  year         = {2010},
  url          = {https://doi.org/10.3390/s100403989},
  doi          = {10.3390/S100403989},
  timestamp    = {Wed, 14 Nov 2018 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/sensors/ZaalDZ10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/ZaalHDZ09,
  author       = {Jeroen J. M. Zaal and
                  Hendrik Pieter Hochstenbach and
                  Willem D. van Driel and
                  G. Q. Zhang},
  title        = {Solder interconnect reliability under drop impact loading conditions
                  using High-speed Cold Bump Pull},
  journal      = {Microelectron. Reliab.},
  volume       = {49},
  number       = {8},
  pages        = {846--852},
  year         = {2009},
  url          = {https://doi.org/10.1016/j.microrel.2009.03.008},
  doi          = {10.1016/J.MICROREL.2009.03.008},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZaalHDZ09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/ZaalDBLBZ08,
  author       = {Jeroen J. M. Zaal and
                  W. D. van Driel and
                  S. Bendida and
                  Q. Li and
                  J. T. M. van Beek and
                  G. Q. Zhang},
  title        = {Packaging influences on the reliability of {MEMS} resonators},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {8-9},
  pages        = {1567--1571},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2008.06.041},
  doi          = {10.1016/J.MICROREL.2008.06.041},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZaalDBLBZ08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}