BibTeX records: Yuki Ohara

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@inproceedings{DBLP:conf/3dic/FukushimaOBMLTK11,
  author       = {Takafumi Fukushima and
                  Yuki Ohara and
                  Jichoel Bea and
                  Mariappan Murugesan and
                  Kang Wook Lee and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Temporary bonding strength control for self-assembly-based 3D integration},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262954},
  doi          = {10.1109/3DIC.2012.6262954},
  timestamp    = {Tue, 16 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/FukushimaOBMLTK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/LeeBFOTK11,
  author       = {Kang Wook Lee and
                  Jichoel Bea and
                  Takafumi Fukushima and
                  Yuki Ohara and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {High reliable and fine size of 5-{\(\mu\)}m diameter backside Cu through-silicon
                  Via(TSV) for high reliability and high-end 3-D LSIs},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262975},
  doi          = {10.1109/3DIC.2012.6262975},
  timestamp    = {Tue, 16 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/LeeBFOTK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/OharaLFTK11,
  author       = {Yuki Ohara and
                  Kang Wook Lee and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Novel detachable bonding process with wettability control of bonding
                  surface for versatile chip-level 3D integration},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262950},
  doi          = {10.1109/3DIC.2012.6262950},
  timestamp    = {Tue, 16 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/OharaLFTK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/MurugesanOBLFTK10,
  author       = {Mariappan Murugesan and
                  Yuki Ohara and
                  Jichoel Bea and
                  Kang Wook Lee and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Impact of microbump induced stress in thinned 3D-LSIs after wafer
                  bonding},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
                  Munich, Germany, 16-18 November 2010},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/3DIC.2010.5751432},
  doi          = {10.1109/3DIC.2010.5751432},
  timestamp    = {Tue, 16 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/MurugesanOBLFTK10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/BeaMONKLFTK09,
  author       = {Ji Chel Bea and
                  Mariappan Murugesan and
                  Yuki Ohara and
                  Akihiro Noriki and
                  Hisashi Kino and
                  Kang Wook Lee and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement
                  of thinned silicon substrates for 3D integration},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306568},
  doi          = {10.1109/3DIC.2009.5306568},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/BeaMONKLFTK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KaihoOTKLTK09,
  author       = {Yoshiyuki Kaiho and
                  Yuki Ohara and
                  Hirotaka Takeshita and
                  Kouji Kiyoyama and
                  Kang Wook Lee and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {3D integration technology for 3D stacked retinal chip},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306564},
  doi          = {10.1109/3DIC.2009.5306564},
  timestamp    = {Wed, 17 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/KaihoOTKLTK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KiyoyamaOLYFTK09,
  author       = {Kouji Kiyoyama and
                  Yuki Ohara and
                  Kang Wook Lee and
                  Y. Yang and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {A parallel {ADC} for high-speed {CMOS} image processing system with
                  3D structure},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306583},
  doi          = {10.1109/3DIC.2009.5306583},
  timestamp    = {Tue, 16 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/KiyoyamaOLYFTK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/LeeKOKBFTK09,
  author       = {Kang Wook Lee and
                  Shigeyuki Kanno and
                  Yuki Ohara and
                  Kouji Kiyoyama and
                  Ji Chel Bea and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Heterogeneous integration technology for {MEMS-LSI} multi-chip module},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306599},
  doi          = {10.1109/3DIC.2009.5306599},
  timestamp    = {Tue, 16 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/LeeKOKBFTK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/OharaNSLMBYFTK09,
  author       = {Yuki Ohara and
                  Akihiro Noriki and
                  Katsuyuki Sakuma and
                  Kang Wook Lee and
                  Mariappan Murugesan and
                  Jichoel Bea and
                  Fumiaki Yamada and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {10 {\(\mathrm{\mu}\)}m fine pitch Cu/Sn micro-bumps for 3-D super-chip
                  stack},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306532},
  doi          = {10.1109/3DIC.2009.5306532},
  timestamp    = {Tue, 16 Feb 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/OharaNSLMBYFTK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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